Proof Of Design
(POD)

 CONSULTANTS TO THE ELECTRONICS INDUSTRY - WORLDWIDE
www.moonmanondarkside.com

208-629-8042
incrater@yahoo.com


Address: WHEREVER THE JOB

Proof Of Design means verifying design intent and validating product quality, effected
in all concurrently agreed upon processes, as meeting customer contract requirements. We
earn a living like most everyone. We work hard to satisfy our customers thereby receiving
satisfaction. It's not just the money but that's the only way we make it.

VISIT OUR WEB SITE AND FIND SO MUCH FREE INFORMATION
YOU MAY NOT NEED US.

This outline tells how POD provides answers concerning vital technical issues instead of creating more
questions – based on more than twenty-five years knowledge, experience, education, and
hands-on involvement. Technical issues include high density, high speed, high reliability
interconnect systems and attendant elements. POD provides in-depth component, material,
design, process, quality, thermal, and acceptance requirements to ensure the highest design
and process efficiency, and effectiveness. POD provides better ways to prevent defect by
managing processes instead of reacting to results. POD helps you get to market faster with
better product and lower costs. Finally, POD helps you keep current customers
continually satisfied while more easily attracting new ones.

Attendant elements include components, circuit design, circuit fabrication, circuit assembly, and quality
system requirements. Circuit design requirements include design rules, drawing elements,
acceptance specifications, and software choices to better effect designs and better introduce
them into well-managed manufacturing process capabilities. Circuit fabrication and assembly requirements
include everything needed to produce compatible designs with the highest efficiency and
effectiveness. Quality system requirements include everything needed to ensure processes are
managed instead of results as defect. The following information outlines those answers
and what they can mean so you can do it right the first time, on time, every time, at the lowest cost:

  • MOST ADVANCED MULTILAYER PRINTED CIRCUIT TECHNOLOGY (rigid, rigid-flex, flex) FOR ALL REQUIREMENTS
  • MOST ADVANCED SURFACE MOUNT TECHNOLOGY FOR ALL APPLICATIONS
  • MORE EFFECTIVE DESIGN FOR MANUFACTURING METHODS AND PROCEDURES
  • MORE EFFECTIVE CONCURRENT ENGINEERING METHODS AND PROCEDURES
  • IMPROVED QUALITY SYSTEM DEVELOPMENT, IMPLEMENTATION, AND QUALIFICATION METHODS AND PROCEDURES
  • LATEST AND BEST DESIGN STANDARDS, DRAWING REQUIREMENTS, AND ACCEPTANCE SPECIFICATIONS
  • DESIGN, MANUFACTURING, AND QUALITY PROCEDURES AND WORK INSTRUCTIONS
  • HANDS ON IMPROVEMENT INVOLVEMENT FOR ALL DESIGN, MANUFACTURING, AND QUALITY PROCESSES
  • COMPONENTS, MATERIALS, FLUXES, SOLDERS, CLEANLINESS, AND THEIR PROCESS REQUIREMENTS
  • INDIVIDUAL AND TEAM TRAINING TO IMPROVE RESPONSIBILITY FULFILLMENT AND PERFORMANCE
  • INDIVIDUAL PERFORMANCE EVALUATION AND REAL-TIME FEED BACK FOR CONTINUOUS IMPROVEMENT
  • MAXIMIZE PRODUCTION YIELDS AND THROUGHPUT WHILE MINIMIZING PRODUCTION TIME AND COSTS
  • ADVANCED COMPONENT AND MATERIAL REQUIREMENTS FOR MULTILAYER PCB, AND SMT
  • THERMAL DESIGN, IMPLEMENTATION, ANALYSIS, CORRECTION, IMPROVEMENT
  • ADVANCED SUPPLIER EVALUATION AND QUALIFICATION METHODS AND PROCEDURES
  • LATEST TEST, ANALYSIS, AND QUALITY REQUIREMENTS TO VERIFY AND VALIDATE PRODUCT QUALITY
  • ISO/QS/AS 9000 QUALITY SYSTEM DEVELOPMENT AND IMPLEMENTATION
  • LEAN MANUFACTURING PROGRAM DEVELOPMENT AND IMPLEMENTATION
  • RELIABILITY AND MAINTAINABILITY PROGRAM DEVELOPMENT AND IMPLEMENTATION
  • FAILURE ANALYSIS AT ALL LEVELS
  • STATISTICAL PROCESS CONTROL
  • BUSINESS PROCESS ANALYSIS AND ACTIVITY BASED COSTING
  • TOTAL PROCESS MANAGEMENT AND IMPROVEMENT
 
 If your company needs assistance, because time or other limitations hinder progress, you should consider
a hands-on consultantcy with the experience, knowledge, ability, and desire to help you get it
done right the first time. If you have a process or quality problem, POD can help “fix” it
and ensure it does not recur. POD ensures you are capable of doing all the above because of having done everything below:
 
POD CLIENTS OVER THE 25 YEARS WITH WHICH WE’VE BEEN CONSULTING WITH MOST RECENT FIRST
  • ITT – MN, Reliability, Availability, and Maintainability Engineering
  • GE – MN, improved DFM/CE program management for medical electronics
  • Intel – OR, design of chassis hardware for advanced generation test capabilities
  • II Morrow – OR, advanced design and test requirements for aircraft navigation systems
  • Universal Avionics – AZ, advanced PCB packaging requirements for civilian navigation systems
  • ITT – NJ, additional solder paste qualification and soldering requirements
  • BAE – NH, advanced test requirements for high density military electronics packaging
  • Visteon – MI, process management improvement using advanced DFM/CE techniques
  • Andrew Wireless – IL, DFM/CE improvement for PCBs
  • Honeywell – AZ, improved PCB design, material, and fabrication requirements
  • H-P – CA, improved thermal management for PCBs
  • Cisco – CA, DFM analysis and recommendations
  • GD – IL, Failure analysis requirements for new components including lead free
  • MA/COM – MA, Failure analysis requirements for new components including lead free
  • GD – AZ, Design support for air traffic control transmitter/receiver system
  • Lockheed/Martin – TX, F-16 hard point circuit upgrade
  • Others signed and awaiting GO as 
  • Sparton Electronics - NPI
  •  Baxter Medical Electronics - CPI
  • Microsoft - Hardware Reliability Engineering



MILITARY AEROSPACE Programs include: Titan, LANTIRN, MX, Trident, Tomahawk,
TOW, HARM, Phoenix, F-16, M1 tank, ALWT, LANTIRN, Bradley fighting vehicle,
Side Looking Radar, and many other extremely high reliability designs and manufacturing processes.

TELECOMMUNICATIONS (Nortel, Arris, Cisco, AT&T, Andrew, Rolm, ADC, ECC, SSE, Lucent,
Watkins-Johnson, California Microwave)

ROBOTICS (Adept)

AEROSPACE (Rolm, Lockheed, HAC, GD, Martin Marietta, Boeing, McDonnell Douglas, SBRC, Ball Bros.,
Coors, Ryan, Convair, Ford, Raytheon, Pratt & Whitney, GE, Sperry, Unidynamics, Kaiser,
Good Year, Motorola, Northrop Grumman, Lear, Lockheed, HAC, Esprit, Univac, UPS/IIMorrow, Universal Avionics)

AUTOMOTIVE (Ford, GM, Brown and Sharpe, and many tier suppliers)

COMPUTER (Cray, IBM, Amdahl, H-P, Four Phase, Cisco, Compaq, Maxtor, Seagate, ISS, Quantum,
Micron, MPM, Gateway, Magnusun, Memorex, Sharred Resources, Maxoptix, Iomega, Syquest, Sun,
Spectra-Physics, Coherent, Shugart, Courier, Adaptec, )

COMPONENT SUPPLIERS (National, Fairchild, TI, Fujitsu, Toshiba, Samsung, Tessera,
Avex, Zilog, AMD, and Micron)

SEMICONDUCTOR EQUIPMENT SUPPLIERS (KLA, K&S)

MEDICAL (J&J, Abbott, Nellcor, Smith-Kline, GE, Beckman Instruments, Becton-Dickson, Guidant)

DOWN-HOLE OIL DRILLING TELEMETRY (Quantum Solutions, Schlumburger, Telco)

INDEPENDENT TEST LABORATORIES (Surface Science, NG, Trace, and M/ACOM, Navy)

PCB FABRICATORS & SUPPLIERS TO THEM (Diceon, Xerox, Proto Engineering, PCB Engineering,
West Coast Circuits, Hadco, TI, ABC, Sanmina, Pacific, Multek, Metropolitan, Buss Systems,
Methode, Praegetzer, NorCal Tech, C&Z, WesTak, Greyhawk, Dynachem, DuPont, Cadence,
Lamination Technology, Isola)

HYBRID CIRCUITS (Sperry, Xerox, Cermetek, RFM, National)

INDUSTRIAL AND HOME POWER GENERATION (Coleman, Honda)

TEST EQUIPMENT & TEST CAPABILITIES (LTX/Trillium, Fairchild, Megatest,
Teradyne, H-P, Testerion, Orbot, Everett Charles, Pycon, Aehr, Tektronix)

ENTERTAINMENT (VideoVision, Muntz, Atari)

ELECTRONIC MANUFACTURING SERVICES (Solectron, SCI, SCA, ESI, Celestica,
Sanmina – SCI, Flextronics, H-P, Agilent, Unitek, Pactron, Pycon)

We’ve worked with off-shore suppliers for just about everything while finding but a few good ones - so far.
POD’s Earl Moon even worked personally with Bill Lear on auto-pilots, aircraft and steam vehicle projects.

POD CAPABILITIES:

Design, Product & Process Development, NPI, DFM/CE, and Manufacturing Engineering: POD
engineers and designs many E/M package types and products as
high density/speed PCB’s, PCBA’s with support hardware to system level.  POD works at component
level ensuring right parts for the job in terms of initial
quality, long term reliability, form, fit, function, and performance. POD works at R&D level as
well as with engineering, design, process, manufacturing, quality, and test engineering people to
ensure designs manufacturable to meet customer contract requirements
on time, the first time, every time, at the lowest cost.

PCB types include high speed/density, impedance controlled (differential pairs as edge-rate
and broad-side in stripline and microstrip circuitry), rigid,
flex, and rigid/flex circuitry using the latest CAD/CAM tools as Cadence Allegro
 with Specttraquest and Valor Enterprise 3000.

POD develops designs and boards using latest materials as
advanced epoxies, polyimide, BT, CIC/CMC, LANXIDE,
ceramics, carbon fiber, CLTE, GTEK, Thermount/Kevlar, and PTFE, MLB constructions. PCBA types
include high volume/low mix and low volume/high mix using all compatible design & assembly
technologies for RF, medical, telecommunications, computer, and military/aerospace
customers. Component types include LCCC, BGA, uBGA,
CCGA, CSP, Flip Chip, COB, thick & thin film hybrid, die attach and wire bond, and
“normal” to x-fine pitch leaded and chip devices.

Note: POD has worked at the component and system assembly levels with area array device types, starting with plastic
BGA’s, since 1994. POD performed in depth R&D component, assembly, and product development as
well as reliability testing over the past 10 years with many companies. POD developed some of
the first reflow profiles and underfill requirements for BGA types. POD performed HALT/HASS
testing as thermal and mechanical cycles to failure analysis determining initial quality and
reliability of BGA solder joints. POD assisted in developing better solder pastes,
stencil requirements, pad configurations and sizes, and rework processes. POD's Earl Moon has
written extensively about BGA rework and have developed training and operations procedures for
manufacturing support concerning solder paste application, reflow, and rework requirements. POD
worked/works with high density area array devices as BGA, uBGA, CCGA, CSP, and the like.  POD
has worked with most all MLB materials, constructions, and processes supporting BGA attachment
ensuring high initial quality and long term reliability.

POD Process Development Engineering: Develop, maintain, and improve component and PCB fabrication
processes as imaging, plating, laminating, etching, drilling, laboratory, inspection, and associated
requirements. Develop maintain, and improve PCB assembly processes as stencil printing, placement,
insertion, soldering requirements in the “front” end as well as many
rework/repair, inspection, test, and acceptance requirements in the “back end.” Work extensively
with various adhesive types and applications for PCB, RF,
and other important requirements needing this type attachment method. “Expert” in all PCB
solder termination process methods (hand, wave, reflow – lead and leadfree) and applications as
well as solder paste and its application, and various flux types.  Experience with most machine types.  Design,
maintain, and improve optical processes as improved design
rules, automation, in line and cellular production requirements, and improved tools for
assembly from the component to system level.

POD Manufacturing Support Engineering: Create, implement, work in and support Lean manufacturing
systems (JIT, continuous flow, pull, and cell with tools as 5S, Kanban, Kaizen, Six Sigma, etc.)
to assure designs and processes, as above, are continuously improved. Experience developing
manufacturing operations from the “ground floor” while bringing them to operational status on
time – within budgetary and production constraints/expectations. Evaluate, qualify, purchase, install,
characterize, and operate most all process and machine types while
implementing safety, ESD, and ergonomic requirements for maximum production
efficiency and effectiveness. Work
closely with sub contractors, as required, and other suppliers to ensure effective supply chain
management (SCM). Write work instructions and procedures for
personnel training so processes are managed instead of results. Provide RoHS (Restriction
of the use of certain Hazardous Substances) and WEEE
(Waste Electrical & Electronic Equipment) consulting as step by step
processes for compliance to the directives.

POD Reliability/Maintainability/Safety engineering: Implement and support ISO/QS programs as
well as setup and maintain SPC requirements for most manufacturing environments. Evaluate
and qualify many supplier types. Support Lean, Six Sigma, CPI and TQM requirements, and
programs to ensure everyone responsible for their contribution to quality and reliability. Use
FMEA/FMECA (D&P), FRACAS, PPAP, APQP, LCC, FTA, HALT, HASS, DOE, SPC, FTA,
FEA, MTBF, MTTF, MTTR, and other quality and reliability methods, tools, and programs to
determine defect cause, and to correct and prevent its return. Know and use MIL-STD-785 (Military
Standard - Reliability Program for Systems and Equipment Development and Production), MIL-STD-1629
(Military Standard - Procedures for Performing Failure Mode and Effects Criticality Analysis),
MIL-HDBK-217 (Military Handbook - Reliability Prediction of Electronic Equipment), MIL-HDBK-470 (DoD Handbook -
Designing and Developing Maintainable Products and Systems), MIL-HDBK-338B (Military Handbook -
Electronic Reliability Design Handbook), MIL-STD-882D (DoD - Standard Practice for System Safety),
MIL-HDBK-472 (Military Standardization Handbook - Maintainability Prediction), MIL-STD-883
(Military Standard - Test Method Standard, Microcircuits), TELCORDIA SPECIFICATIONS, SAE FMEA 5580,
DO-178B Development Levels A-D, DO-254, DEF STAN 00-55, DEF STAN 00-56, SAE ARP4754,
NUREG-0492, AC25.1309-1A, SAE ARP 4761 etc. Ensure all quality and reliability data converted to
useful information, using Excel & Relex software, for
continuous design and process improvement.

POD Failure Analyisis: When quality and reliability requirements not met as specified, perform failure analysis,
often while working with major independent test laboratories, from the component to system level and feed
back failure mode findings to effect corrective action and ensure designs and/or processes improved as required.
In-depth knowledge of most laboratory analytic and test methods as SEM, EDX, ESCA, AES, SIMS, Auger, FTIR,
PIND, C-SAM, ESD/EOS failure analysis, X-sectioning,
thermal, moisture, RGA, TMA, DSC, X-RAY, EBIC, etc. Intimate with most commercial and military
standards, specifications, and test methods.
 
POD Quality Engineering: Implement and support ISO/QS/AS & ISO/TS16949:2002 programs as well as setup and maintain
SPC requirements for most manufacturing environments. Management representative responsible for
all audit and reporting activities concerning quality program status and required changes. Provide quality
training, conduct post-mortem and MRB activities, and ensure all quality and inspection procedures and
methods as specified and used properly. Evaluate and analyze defect,
collect quality data and change it into useful information (histograms, cause and effect
diagrams, as well as all other statistical
evidence charts) providing corrective action and design/process improvement
requirements. Evaluate and qualify suppliers
and assure continuous performance in accordance with contract requirements. Support Lean, Six Sigma, CPI and TQM
requirements, and programs to ensure everyone responsible for their contribution to quality.
 
 OUR ONLY JOB IS CONSULTING WITH LEADERS,
 OR THOSE WANTING TO BE LEADERS, IN THE ELECTRONICS WORLD.
 
 We also help start-ups take off, fly, and land safely. We help many
 others find and fix what's broken so they too may become leaders using
 POD Total Process Management, and DFM/CE tools and methods.
 
TRY OUR REDUCED RATE ON-LINE CONSULTING SERVICE
(COMPARED WITH OUR LOW COST ON-SITE SERVICE)
AT ABOUT 1/2 THE PRICE. THIS SERVICE WORKS WELL ONLY
WHEN CLEARLY ESTABLISHED
COMMUNICATIONS PROVIDE ALL CUSTOMER NEEDS. THESE NEEDS
MAY BE PHOTOS, TEXT, X-SECTIONS, LAB REPORTS, OR WHATEVER
PRESENTS CLEAR PROBLEM EVIDENCE. POD WILL PROVIDE A
PROPOSAL AND CONCISE STATEMENT OF WORK FOR ALL CONTRACTS
ALONG WITH REGULAR PROGRESS REPORTS AND PROBLEM
 RESOLUTIONS.
 
 www.moonmanondarkside.com
 incrater@yahoo.com
208-629-8042