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REWORK, REPAIR, MODIFICATION
SECTION
SRT 1000 BGA REWORK









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PROCEDURE.
WENESCO REWORK MACHINE
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SRM4 REWORK MACHINE
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PCB DESIGN SECTION




COMPONENT SECTION






















PCB FABRICATION
SUPPLIER CAPABILITIES SUPPLIER EVALUATION -
PROCESS MANAGEMENT
EFFECT		 SUPPLIER QUALITY
GOOD AND/OR BAD


Supplier capabilities must start with a
professional, knowledgeable management
team having created and implemented
a sound business plan with which to
create an organization, staff it, provide
direction for it, and manage it.		 NO SUCCESS OR $$$$ NO CUSTOMER SATISFACTION
SO NO CUSTOMERS


After management and a sound business
plan, it all starts with a professional
customer service team.		 I can't count the times I never went any
farther when encountering non professional
customer service people but when good,
I continue.		 NO CUSTOMERS


Upon receipt of customer files, they are
edited and the DFM/CE process is begun
working with the customer to ensure
the design is producible and processes
are capable of providing specified
quality in accordance with the master
drawing.

CAM editing results acceptable for
production.		 N/A


After formal DFM process and concurrent
acceptance of design and process
capabilities, planning is started that affects
all following departments and processes.

CAM flow chart.

ALL THE WAY TO FINISHED PRODUCT
AND IT'S ACCEPTABLE


After effective planning process management,
 working film is plotted and digitally
transfered for use in photo imaging.

REQUIRED PLOT		 ALL THE WAY TO FINISHED PRODUCT
AND IT'S ACCEPTABLE


After effective plotting process management,
 working film is produced in a highly
controlled environment for use in photo imaging.

REQUIRED FIRST GENERATION ARTWORK
PRODUCED AND USED UNDER STRICTLY
CONTROLLED CLEANLINESS AND
ENVIRONMENTAL
CONDITIONS

ALL THE WAY TO FINISHED PRODUCT
AND IT'S ACCEPTABLE


Also, after effective planning process
management, laminate, core, and prepreg
material is cut into panel sizes, stored, and
released to production on demand.

Table for MLB material selections
meeting master drawing and internal
process requirements.


ALL THE WAY TO FINISHED PRODUCT
AND IT'S ACCEPTABLE
So image process is effective, inner layer panels
must be cleaned as in this case using
an auto-load and unload clean line to
 "sand blast" inner-layers with aluminum
oxide prior to dry-film. The dry film
Image department, in clean-room atmosphere,
 is capable of producing photo-imaged panels
 meeting all customer specified, fine-line
requirements. Equipment and other
requirements in this area includes dry
 film lamination (in this case – fully automatic)
and highly trained image personnel working
in a Class 10,000 environment to prevent
 imaging defects. Finally, in image, a fully
automatic Dynachem shooter delivers
consistent registration meeting volume and
 quality requirements.		 N/A N/A


Panel cleaning to promote image resist adhesion.		 Panels must be clean or no
dry film adhesion or innerlaminar
bond possible.		 N/A


Dry film photo imageable resist coating/laminating.		 Imaging process must effect exact
or modified image of board trace and
space & other feature characteristics.		 N/A


After effect the film production process
management,  working film is used
to image, develop, and strip PCB panels
within a clean room environment.		 Imaging process must effect exact
or modified image of board trace and
space & other feature characteristics.		 N/A



Image developing process.		 Once imaging effected, image is
developed just as in any other
photographic process.


 N/A


Image etch.

Perfect etch effects.

ARE YOU KIDDING ME?


Inner and outer Automated Optical Inspection.

Pit in trace detected by AOI.		 N/A


Lamination process, vacuum or not, must be
carefully managed as this is the last time
you have a chance to get it right before the
scrap heap.

Lamination press cycle.


Everything acceptable.


Drill Optimization and Material Staging
requires an x-ray drill optimizer
 that loads, processes, and unloads
panels automatically to ensure
optimal drill registration on
every panel.

Perfect layer to layer registration.

Not x-ray or anything else saw this
misregistration.


Drill processes must be capable of being
managed to ensure all hole requirements
meet customer needs.

Drill tools.

Poor drilling evidenced as rough hole walls, nail heading,
gouges, and smear removal and etch back
non existent.


De-smear/Etch-back requires computer-controlled
plasma systems guarantee consistent hole cleaning.
In addition, it captures pads for effective micro-via
 treatment. It should be noted that plasma works
exceptionally well on polyimide boards. It works
well for all other board types but older
chemical processing, as permanganate, works
well with epoxy resin system types. In all cases,
resin smear must be prevented for obvious
reasons shown.

Permanganate etch back processes
audited before start and at regularly
specified intervals.

Absolutely no smear removal or etch
back evident.


The metalization process uses electroless or
direct metalization – in this case it is called
shadow. This process is completed in 8
minutes as opposed to the 2 hours required
for electroless copper and does
not give employees cancer. Either process
provides a thin copper interface, adhering
to the drilled and cleaned hole walls, so
electro-plated copper is plated
to the interface meeting minimum specified
requirements for plating thickness and ductility.
Always, all processes are audited before
introducing any order or material to
the heretofore unknown process capability or
condition thereby assuring quality requirements
are consistently met

Plating line audited before start.
and at regularly specified intervals

No plating process management as hole cracked
during thermal stress testing because, partly,
plating temp too low.


Solder mask processes must be capable of being
managed to meet customer specified requirements.
The first process requires cleaning panels before
LPI application. The second process step is to apply
 the liquid photo imageable material. The next process
cures the mask. The mask is imaged with outer-layer
artwork – again, in a clean-room environment. Finally,
the mask is developed, and stripped where required
producing effects not like the defect ridden last image.		 Solder mask does only one key thing - prevent
solder shorting between two traces conductors.
If not processed effectively, irreversible problems
will exist

This is solder mask not stripped from pad
or hole walls. Imagine how much this
cost a very good board shop and a very large
computer company.


The Hot-air Solder Leveling (HASL) process is
done (but never well – as everyone knows by now)
using auto load and unload equipment for pre-clean
and post-clean, this operation can be accomplished
 with only one operator.		 The HASL process is better than before, but
still not an acceptable SMT solder termination
area finish.

HASL for never.


Electroless Nickel - Immersion Gold (ENIG) is well managed with
new lines using chemistry specifically designed
to eliminate any possibility of phosphorus buildup
at the nickel interface layer, most always resulting
in defect-free solder connections at assembly.		 The ENIG process, when properly managed
today, is about as good as it gets. We hardly ever
see problems with it now and it remains
one of the best solder termination are finishes
for flatness and solderability.

NEW ENIG GOOD.            OLD ENIG BAD.


Gold Connectors are effected often using
fully automatic plating lines assuring consistency
and tight control of finished gold thickness.		 Gold connector fingers are plated
with hard gold over nickel for wear
resistance and this process has been
around since the beginning.

Acceptable gold finger contacts.


Silk Screening is effected using UV-curing legend
inks, usually, to save an hour and a half total cycle
time – on average.		 Silk screening still is mostly a manual process
and is more an art form than a science
though careful process management is
required to ensure clearly legible markings
are visible for all subsequent process
requirements.

Acceptable screen marking.


Board fabrication processes must be capable of being
managed to ensure PCB outline and special features
meet customer specified requirements obviously not as
below right. Don’t forget design problems that can be
translated to the problem shown and many others
PROBLEM CAUGHT IN WELL MANAGED
OPERATION
This process requires using a router to all outline
and board features are as specified. I believe there
should be no V scoring available anymore in this
time of very fine line and tight component spacing.
Routing is the only way to go in the fabrication
process and in the assembly process.

PROBLEM NOT CAUGHT IN POORLY
MANAGED OPERATION
What happened here?


Panel Scoring often is effected using v-scoring machines.
Of course, I have issues with this during assembly
de-panelization. During assembly, it must be assured
no component or solder joint damage is effected using
"pizza cutter technology," so to speak. Assembly panel
routing is the only way to go to ensure this process
prevents instead of causes damage.

Let's outlaw this process but, if not, be sure
to practice concurrent engineering here as the
board shop may have different panelization
requirements than the assembly house.

Panelized for the assembler not always
same as required by fabricator.
This requires concurrent engineering.


The state-of-the-art drill shown is used for test fixtures
and controlled-depth drilling of blind vias. It senses
inner layers and counts to the proper layer.
Electrical testing processes must be capable of being
managed to ensure PCB’s meet customer
specified continuity requirements. The equipment shown is
capable of testing both sides simultaneously using
the board’s net-list to program the equipment. This
 particular machines’ grids
have 200 test points per square inch, instead of the
 standard 100 points.		 Concurrent engineering really required here
to get it right.
 		N/A


In-process and final inspection, packaging, and shipping
processes must be capable of being managed to ensure
customer specified requirements are
met before shipment.		 I abhor inspections but to derive useful information
concerning how to improve designs and the
processes to which they will be subjected.		 N/A


It’s back to the initial lab process equipped to perform
chemical and bath additions and audits
before any material is subjected to a process
 as well as analyzing waste water.

This mostly is where defect is prevented by careful
analysis of all going into each process. This is
where the PCB fabrication supplier evaluation
and qualification process begins.

NODULES AND THAT AIN'T GOOD


The last lab analysis consists of cross sectioning,
before and after thermal stress and shock, solderability,
impedance, hi-pot, spectroscopic, peel strength, ionic
contamination, and capacitance-hook prior to shipment.
Everything found, good and bad, then is correlated back
to the “first” lab where preventive analysis
was effected to ensure no defect found in
“final” lab. When defect found, processes and/or
designs are corrected and defect is prevented from
recurring.

This is a lot of what we look for inside a hole.
See IPC 600 for details and see why.

The x-section report corresponds directly with
customer master drawing requirements specifying
IPC 600 requirements.


Internal waste treatment analysis and process capabilities
to ensure all waste water and chemical elements meet
regulatory
specified requirements.		 When waste is bad it's bad for everyone and the
board shop owner goes to jail just as so many
have.

Back in the "good" old days, Waste water
was analyzed by placing gold fish in it. If they
lived, the water was sent to the bay or other
water ways. If they didn't live, water was often
sent there anyway but some attempted cleaning
it up, or not.

BELLY UP!
PCBA SECTION - STENCIL PRINT
Stencil Print
























COMPONENT PLACEMENT













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PODWORLDINPICS2